Processing Machinery
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Internal Voids of LCP Products Exposed After Soldering
Problembeschreibung
【Problem Phenomenon】After reflow soldering, X-ray inspection of LCP products finds internal voids enlarged, affecting sealing and strength
Ursachenanalyse
Original internal micropores expand as gas expands under soldering high temperature, and the pores sealed by rapid crystallization are fixed; insufficient compensation in thick-wall areas is the source of micropores; during on-site troubleshooting, verify item by item according to this mechanism to avoid blindly adjusting the machine based solely on experience
Lösung
Optimize holding compensation in thick-wall areas to eliminate micropores; X-ray sampling inspection of high-risk parts before soldering; structural design avoids local excessive thickness; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Wichtigste Erkenntnis
Soldering exposes internal voids; the source is insufficient thick-wall compensation, which requires upfront process control; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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