Processing Machinery
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PCABS thin-wall electronic part process
Problembeschreibung
【Problem Phenomenon】Thin-wall PC/ABS such as notebook housings of 0.8mm are difficult to fill
Ursachenanalyse
Thin-wall consumer electronics require high-flow grades plus high melt temperature and high speed; at 0.8mm wall thickness, the melt front freezes quickly, the process window is narrow; during on-site troubleshooting, verify item by item according to this mechanism, and avoid blindly adjusting the machine based on experience alone
Lösung
Select high-flow grade; take the upper limit of the melt temperature window; high-speed injection with sufficient venting; mold temperature upper limit; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Wichtigste Erkenntnis
PC/ABS thin-wall 0.8mm relies on high-flow grade plus high speed and high mold temperature; after confirming effectiveness, fix the parameters and practices into the work instruction to prevent recurrence
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