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Problem & Lösung

Praktische Antworten auf häufige Herausforderungen mit Kunststoffmaterialien

11636 Fragen
Q
DSTDP extrusion '2079851475616104457 severe parison sag
A
Parison sag is caused by low melt strength; slight crosslinking and wall thickness control are key
Blow Molding DSTDP '2079851475616104457parison sagmelt strengthslight crosslinkingwall thickness control
Q
DSTDP product dimensional change during long-term storage
A
Dimensional change is caused by physical aging; annealing treatment and slight crosslinking are the measures to stabilize dimensions
Material Analysis DSTDP dimensional stabilityphysical agingannealingsecondary crystallizationslight crosslinking
Q
DSTDP blended with incompatible resins delamination
A
Blends with large polarity differences require reactive compatibilizers that form chemical bonding at the interface to solve
Extrusion & Post DSTDP blend delaminationpolarity differenceDSTDP-g-MAHreactive compatibilizationinterfacial bonding
Q
DSTDP '2079851475616104452 thick-wall bubbles
A
Thick-wall bubbles are caused by a combination of insufficient holding pressure, moisture and poor venting
Material Drying DSTDP injectionbubblesholding pressurethick-wall productmold venting
Q
DSTDP extrusion melt fracture
Q
DSTDP '2079851475616104452 demolding difficulty
A
Demolding difficulty is caused by adhesion and insufficient mold design; increasing demolding draft is the fundamental measure
Injection Molding DSTDP injectiondemolding difficultydemolding draftadhesionejection design
Q
Poor interfacial bonding between DSTDP and filler
Q
Elliptical Deformation of CMC Products
A
Elliptical deformation is caused by asymmetric demolding force; uniform ejection is the key
Molds & Tooling CMCelliptical deformationsymmetric ejectionuniform coolingsetting time
Q
Internal Delamination Cracking of CMC
A
Internal delamination is caused by poor interface and shrinkage differences; compatibilizer and uniform cooling are the key
Extrusion & Post CMCinternal delaminationinterfacial adhesioncompatibilizeruniform cooling
Q
Snakeskin Pattern on CMC Surface
A
Snakeskin pattern is caused by low-temperature extrusion and elastic recovery; temperature increase and speed reduction are the key
Extrusion & Post CMCsnakeskin patternextrusion temperatureelastic recoverydie temperature control
ChemAI