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11636
Fragen
Q
PC Assembly Stress Cracking
A
PC assembly cracking is stress superposition; torque and interference must be controlled; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar probl...
Processing Machinery
assembly stress
torque
interference
cracking
Q
PC Weld Line Bubbles
A
For PC weld line bubbles, check venting and drying; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
Material Drying
weld line bubbles
venting
confluence
drying
Q
PC Delayed Cracking
A
PC delayed cracking is a stress debt; annealing and evaluation for prevention; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the ...
Processing Machinery
delayed cracking
internal stress
annealing
evaluation
Q
PC Mold Deposit
A
PC mold deposit requires regular cleaning, with venting as the focus; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
Molds & Tooling
mold deposit
precipitation
cleaning
venting
Q
PC Gate Mark Whitening
A
PC gate marks rely on position plus sharp trimming; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
Molds & Tooling
gate marks
whitening
trimming
submarine
Q
PC Cold Slug Marks
A
For PC cold slug marks, check the nozzle and cold slug well; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
Processing Machinery
cold slug marks
nozzle
cold slug well
injection speed
Q
PC Jetting Marks
A
PC jetting marks rely on the gate wall-impinging arrangement; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
Molds & Tooling
jetting marks
gate
wall attachment
initial speed
Q
PC Flow Marks
A
For PC flow marks, raise the temperature and stabilize the speed; high viscosity is the internal cause; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting...
Injection Molding
flow marks
mold temperature
injection speed
viscosity
Q
PC Uneven Gloss
A
For PC gloss difference, check mold temperature uniformity; stress also affects it; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in...
Molds & Tooling
uneven gloss
mold temperature
polishing
stress
Q
PC Dimensional Deviation
A
PC dimensions rely on parameter locking and SPC monitoring; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
Material Drying
dimensional deviation
shrinkage
SPC
parameters
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11636
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1506
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1506
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2025
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2239
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315
Thermoforming
141
Material Analysis
1343
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382
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