Extrusion & Post
5 조회수
Warpage deformation
문제 현상
Laminated boards or products bend and twist after leaving the mold.
Deformation usually gradually intensifies after demolding, especially in asymmetric structures or parts with large wall thickness differences.
This problem causes product dimensions to exceed the tolerance range, affecting assembly accuracy and product function.
원인 분석
(1) Shrinkage control aspect: asymmetric laying direction of reinforcement materials in each layer causing anisotropic shrinkage; uneven volume shrinkage causes internal stress and dimensional deviation.
(2) Temperature parameter aspect: uneven hot pressing temperature causing inconsistent shrinkage in various regions; temperature deviation directly affects the physicochemical state and reaction progress of the material.
(3) Process speed aspect: cooling speed too fast producing thermal stress; speed parameters affect the synchronization of material flow state and reaction progress.
해결 방법
(1) Implementation measures: use symmetric balanced layup design; formulate specific operation plans based on actual production conditions and verify implementation effects.
(2) Implementation measures: ensure uniform hot platen temperature; formulate specific operation plans based on actual production conditions and verify implementation effects.
(3) Process control: control cooling rate; establish an online monitoring mechanism, set parameter upper and lower limits and implement alarm management.
(4) Implementation measures: keep products under pressure on the press to cool to room temperature., formulate specific operation plans based on actual production conditions and verify implementation effects.
(5) Preventive measures: perform shrinkage and warpage simulation analysis during the product design stage to optimize structure and process plans in advance.
핵심 요약
Deformation problems originate from internal stress caused by uneven shrinkage or heating in various parts of the product, and need to be systematically solved from three aspects: structural design, process parameters, and post-treatment.
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