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Extrusion & Post 5 조회수

Board edge peeling

문제 현상
Layers at the laminate edge separate. The interlayer separation phenomenon gradually expands after the product is stressed or subjected to environmental action, seriously affecting structural integrity.
원인 분석
(1) Process factor: low resin content at edges or excessive resin bleed-out making edges resin-starved; this factor affects the '2079851475616104453 and final quality of the product. (2) Stress distribution aspect: stress generated during edge trimming causing edge layer peeling; internal stress concentration causes the product to crack or deform during subsequent use. (3) Process factor: edges not fully cured before cutting; this factor affects the '2079851475616104453 and final quality of the product.
해결 방법
(1) Implementation measures: appropriately apply more resin at the edges during lamination; formulate specific operation plans based on actual production conditions and verify implementation effects. (2) Implementation measures: trim edges after the product is fully cured; formulate specific operation plans based on actual production conditions and verify implementation effects. (3) Material selection: use sharp tools to avoid mechanical damage., establish material selection evaluation standards and determine the optimal solution through comparative tests. (4) Preventive measures: establish interlayer bonding strength testing standards, regularly sample interlayer shear strength, and monitor process parameter stability.
핵심 요약
The essence of interlayer separation problems is insufficient interface bonding force, requiring systematic improvement from three aspects: impregnation quality, interlayer cleanliness, and process parameters.
resin content board edge peeling process optimization

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