Board bursting of laminated parts in high-temperature high-pressure water environment

Multilayer copper-clad laminates burst and delaminate internally during lead-free soldering (above 260°C). This problem is relatively common in lamination molding production and requires comprehensive analysis and solution from multiple aspects of material, process, and equipment.

(1) Material pretreatment aspect: Trace moisture inside the material instantly vaporizes and expands at high temperature (similar to the popcorn effect), Moisture vaporizes at high temperature to produce gas or participates in side reactions, causing internal defects in the product. (2) Material aspect: Fluctuations in raw material performance indicators or insufficient pretreatment affect molding quality. (3) Process aspect: Control deviation of key process parameters causes the '2079851475616104453 to deviate from optimal conditions. (4) Equipment aspect: Equipment precision and maintenance status affect the stable execution of process parameters.

(1) Material selection: Thoroughly dry the laminate at 125°C for more than 24h before use, Establish material selection evaluation criteria, and determine the optimal solution through comparative tests. (2) Process control: Control the water absorption rate of the material, Establish an online monitoring mechanism, set upper and lower parameter limits, and implement alarm management. (3) Implementation measure: Adjust the reflow soldering temperature profile., Develop a specific operation plan based on actual production conditions, and verify the implementation effect. (4) Preventive measure: Establish sound process control standards and a quality inspection system, and regularly review process data for continuous optimization.

This problem requires comprehensive analysis from multiple dimensions of material, process, equipment, and operation, and should be solved by systematically optimizing process parameters and the quality control system.