메뉴
재료 기계
인사이트
기사 동영상 문제 및 해결책
About
Chembull 소개 미디어 파트너
문의하기
언어
EnglishالعربيةPortuguêsEspañolDeutschTürkçe한국어
문제 및 해결책으로 돌아가기
Material Drying 4 조회수

Surface defect amplification in ABS electroplating

문제 현상
After electroplating of electroplating-grade ABS, pitting, blistering, and poor coating adhesion appear, with a high defect rate.
원인 분석
Silver streaks, stress marks, mold release agent residues, and moisture bubbles on the injection molded surface are amplified during electroplating; uneven roughening leads to poor coating adhesion; defects on the '2079851475616104452 end will erupt concentratedly on the electroplating end.
해결 방법
①Strictly dry electroplating-grade ABS and avoid using mold release agents; ②eliminate '2079851475616104452 defects such as silver streaks/bubbles before electroplating; ③standardize the roughening—neutralization—predipping process; ④store the products moisture-proof and pollution-proof; ⑤do coating adhesion verification.
핵심 요약
The appearance of ABS electroplated parts is determined by the '2079851475616104452 front end: electroplating is an 'amplifier', and no '2079851475616104452 defect can be hidden; no mold release agent, strict drying, and stress control are the three iron rules of electroplating-grade ABS.
ABS;electroplating;adhesion;roughening;surface defects

이 정보가 도움이 되었나요?

0 명이 도움이 되었다고 합니다

ChemAI