Material Drying
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Blistering in Reflow Soldering Caused by Insufficient Drying of LCP Pellets
문제 현상
【Problem Phenomenon】After reflow soldering or a 280℃ oil bath test, bubbles and bulges appear on the surface of LCP connector products, with a blistering rate of about 1-2%, concentrated in individual cavities of multi-cavity molds
원인 분석
Although LCP has a low moisture absorption rate, when moisture is adsorbed on the pellet surface and drying is not thorough, the moisture vaporizes instantly during high-temperature soldering and forms bubbles under the skin layer; Celanese Tech Tips points out that insufficient drying and excessive shear are the two main causes of soldering blistering, and the 24-cavity buzzer case had a blistering rate of 1-2%
해결 방법
Before molding, dry fully according to the resin supplier's requirements and control the dew point, and use up within 2 hours after drying; do not set the barrel temperature too low, and avoid relying on high shear heat for melting; use a 280℃ oil bath sampling test to verify the drying effect before mass production
핵심 요약
For reflow soldering blistering, check drying and shear heat first; oil bath sampling can expose risks in advance; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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