Molds & Tooling
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Warpage Caused by Uneven Mold Temperature of PEEK
문제 현상
PEEK products bend and twist after demolding, with flatness out of tolerance; the warpage direction correlates with the mold temperature distribution, and the deformation amounts of thick-wall and thin-wall areas are inconsistent.
원인 분석
When the cavity surface temperature difference exceeds ±5℃, different regions reach different crystallinities, high-crystallinity regions shrink more, generating internal bending stress; PEEK warpage is essentially a crystallinity management problem rather than a simple cooling problem.
해결 방법
①Use a surface thermometer to map the cavity temperature distribution and control the temperature difference between the front and rear mold halves within 10℃; ②Optimize cooling water channels to achieve uniform heat transfer; ③Appropriately reduce holding pressure to decrease residual stress; ④Extend the cooling and setting time.
핵심 요약
The core of PEEK warpage control is mold temperature uniformity; ±3℃ mold temperature control accuracy is a basic requirement for precision parts; conformal cooling channels have significant value for complex PEEK parts.
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