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문제 및 해결책

일반적인 플라스틱 재료 문제에 대한 실질적인 답변

740 질문
Q
Poor Antistatic Effect of CMC
A
Poor antistatic effect is caused by insufficient addition; increasing antistatic agent is the key
Molding Process CMCantistaticantistatic agentsurface resistancemigration rate
Q
Large Compression Set of CMC
A
Large compression set is caused by insufficient crosslinking; increasing crosslinking degree is the key
Molding Process CMCcompression setcrosslinking degreeelastic recoveryreinforcing filler
Q
Surface Stress Whitening of CMC
A
Stress whitening is caused by orientation and internal stress; reducing orientation and annealing are the key
Molding Process CMCstress whiteningorientation stressannealing treatmentstress concentration
Q
Coarse Internal Crystallization of CMC
A
Coarse crystallization is caused by slow cooling; fast cooling and nucleating agent are the key
Molding Process CMCcoarse crystallizationspherulite refinementnucleating agentcooling rate
Q
CMC Extruded Film Thick at Edges and Thin in the Middle
A
U-shaped thickness is caused by die flow channel and swell differences; coat-hanger die and gap fine-tuning are the key
Molding Process CMC filmthickness distributioncoat-hanger diegap fine-tuningedge effect
Q
Material Sticking to Sizing Sleeve of CMC Extruded Pipe
A
Sizing sleeve sticking is caused by elastomer adhesion characteristics; polishing and lubricating water are the key
Molding Process CMC pipesizing sleeve stickingpolishinglubricating waterelastomer adhesion
Q
Poor Thickness Uniformity of CMC Extruded Film
A
Film thickness uniformity needs coordinated optimization from three aspects: die design, gap adjustment and cooling
Molding Process CMC filmthickness uniformitydie designdie swellair ring cooling
Q
Yellowing of CMC Products After Processing
A
Q
CEF hardness too low
A
Low hardness is caused by the softness of the material and excessive plasticization; adding fillers is the key
Molding Process CEFhardness too lowrigid fillerplasticizercrystallization control
Q
CEF impact strength fluctuation large
A
Impact fluctuation is caused by unstable dispersed phase and crystallization; stabilizing the processing is the key
Molding Process CEFimpact fluctuationdispersed phase particle sizenucleating agentprocessing stability
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