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문제 및 해결책

일반적인 플라스틱 재료 문제에 대한 실질적인 답변

11636 질문
Q
MP insufficient flatness
A
insufficient flatness is caused by shrinkage difference and stress; uniform cooling and annealing are key
Molds & Tooling MP flatness shrinkage difference uniform mold temperature annealing
Q
MP internal unmelted particles
A
unmelted particles are caused by insufficient plasticization; raising temperature and reducing feeding are key
Processing Machinery MP unmelted particles plasticization capacity processing temperature screw mixing
Q
MP poor chemical resistance
A
poor chemical resistance is caused by MP chemical affinity; selecting a chemical-resistant grade and coating are key
Material Analysis MP chemical resistance chemical attack slight crosslinking surface coating
Q
MP large processing odor
A
large odor is caused by MP decomposition volatilization; temperature control and ventilation are key
Material Analysis MP processing odor volatiles ventilation temperature control
Q
MP large impact strength fluctuation
A
impact fluctuation is caused by dispersed phase and crystallization instability; stable processing is key
Molding Process MP impact fluctuation dispersed phase particle size nucleating agent processing stability
Q
MP large creep deformation
A
large creep is caused by the elastomer nature; slight crosslinking and rigid filler are key
Material Analysis MP creep slight crosslinking high molecular weight rigid filler
Q
MP insufficient tensile strength
A
insufficient tensile strength is caused by molecular weight and poor interface; selecting a high MW grade is key
Material Analysis MP tensile strength molecular weight coupling agent orientation control
Q
MP internal shrinkage cavity
A
shrinkage cavity is caused by thick-wall shrinkage and insufficient holding; extending holding is key
Molds & Tooling MP shrinkage cavity thick wall holding time gate freezing
Q
MP poor antistatic effect
A
poor antistatic effect is caused by insufficient addition; increasing antistatic agent is key
Molding Process MP antistatic antistatic agent surface resistance migration rate
Q
MP processing temperature fluctuation
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