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ECTFE high-temperature creep deformation

Core concern for long-term load bearing

Molding Process ECTFEcreep

Difficult filling of ECTFE long-flow products

Gate layout is the key

Molding Process ECTFEfilling difficulty

Pipe flange leakage

Flange is the weak link of the piping system

Molding Process ECTFEflange

Insufficient pipeline thermal compensation

Thermal compensation is a key point of pipeline safety design

Molding Process ECTFEthermal compensation

Internal shrinkage porosity of ECTFE thick-walled products

Internal quality of thick-walled parts is a technical difficulty

Molding Process ECTFEshrinkage porosity

Difficult wall thickness control of large-diameter pipe

Wall thickness control of large-diameter pipe is a difficulty

Molding Process ECTFElarge diameter

Excessive shear degradation

ECTFE is shear sensitive and needs control

Molding Process ECTFEshear

Processing temperature too low and poor plasticization

Processing temperature window determines plasticization

Molding Process ECTFEpoor plasticization

TOC content exceeding standard

TOC control is key in the microelectronics industry

Molding Process ECTFETOC

Difficult and uneven coloring

High temperature resistant pigments must be used

Molding Process ECTFEcoloring

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