Menu
Materiais Máquinas
Perspetivas
Artigos Vídeos Problema e solução
About
Sobre a Chembull Parceiros de média
Contacte-nos
Idioma
EnglishالعربيةPortuguêsEspañolDeutschTürkçe한국어

Problema e solução

Respostas práticas para os desafios comuns dos materiais plásticos

740 perguntas
Q
DSTDP large impact strength fluctuation
A
Impact fluctuation is caused by dispersed phase and crystallization instability; stabilizing processing is key
Molding Process DSTDPimpact fluctuationdispersed phase particle sizenucleating agentprocessing stability
Q
DSTDP poor antistatic effect
A
Poor antistatic effect is caused by insufficient addition; increasing antistatic agent is key
Molding Process DSTDPantistaticantistatic agentsurface resistancemigration rate
Q
DSTDP processing temperature fluctuation
A
Temperature fluctuation is caused by improper temperature control system; PID tuning and heating band replacement are key
Molding Process DSTDPtemperature fluctuationPID tuningheating bandthermocouple
Q
DSTDP surface stress whitening
A
Stress whitening is caused by orientation and internal stress; reducing orientation and annealing are key
Molding Process DSTDPstress whiteningorientation stressannealing treatmentstress concentration
Q
DSTDP large compression set
A
Large compression set is caused by insufficient crosslinking; increasing crosslinking degree is key
Molding Process DSTDPcompression setcrosslinking degreeelastic recoveryreinforcing filler
Q
DSTDP internal coarse crystallization
A
Coarse crystallization is caused by slow cooling; fast cooling and nucleating agent are key
Molding Process DSTDPcoarse crystallizationspherulite refinementnucleating agentcooling rate
Q
DSTDP extruded film thick edges and thin middle
A
U-shaped thickness is caused by die flow channel and swell differences; coat-hanger die and gap fine adjustment are key
Molding Process DSTDP filmthickness distributioncoat-hanger diegap fine adjustmentedge effect
Q
Insufficient Dissolution in CMC Solution Preparation
A
CMC dissolution needs pre-dispersion and full stirring to prevent surface gel coating
Molding Process CMC dissolutionpre-dispersionstirring speedsurface gel layerdissolution time
Q
CMC Hardness Too Low
A
Low hardness is caused by material softness and excessive plasticization; adding filler is the key
Molding Process CMClow hardnessrigid fillerplasticizercrystallization control
Q
Large Impact Strength Fluctuation of CMC
A
Impact fluctuation is caused by unstable dispersed phase and crystallization; stable processing is the key
Molding Process CMCimpact fluctuationdispersed phase particle sizenucleating agentprocessing stability
Anterior 1 ... 42 43 44 45 46 47 48 ... 74 Seguinte
ChemAI