Degradation of Moisture-Sensitive Materials

Materials such as PC and PA become brittle or have severe silver streaks after molding. When this defect appears in parts of Process No. 1, it is usually related to specific process parameter ranges or equipment conditions. If it persists, it will directly affect the part qualification rate and production cycle, increasing material loss and rework costs. Timely diagnosis and elimination is a basic requirement for ensuring stable production.

1. Material factors: material hydrolyzes at high temperature after absorbing moisture, molecular weight drops sharply, insufficient drying. 2. Temperature factors: the settings of barrel temperature and mold temperature directly affect melt fluidity, cooling rate, and crystallization behavior; low temperature is a common cause of filling and molding quality problems, and precise control is required according to the material's recommended processing window. 3. Mold comprehensive factors: in addition to venting, mold design parameters such as cooling water channel layout, gate position and size, and demolding draft angle all have a systematic impact on part quality, and optimization is required from the source of mold design.

1. Process parameter optimization and adjustment: strictly dry fully according to material requirements, use a dehumidifying dryer, monitor material moisture content, shorten hopper residence time. 2. Systematic troubleshooting method: troubleshoot item by item in the order of "parameters -> material -> mold -> equipment". First adjust the parameters that are easiest to change, such as injection pressure and temperature, and observe the effect; if there is no improvement, check the drying and fluidity of the raw material; further check mold venting and gate design; finally check the mechanical condition of the equipment (check ring, screw). Change only one variable at a time to determine the root cause. 3. Preventive management: establish standardized process parameter cards and quality control limits for each mold/product, and regularly conduct process capability index (CPK) evaluation. For recurring problems, use fishbone diagram or 5Why analysis to trace the root cause, and fix the countermeasures as PFMEA control points.

This problem is a typical manifestation of moisture-sensitive material degradation in '2079851475616104452; the core of the solution lies in eliminating the root cause of the defect through systematic optimization of process parameters (temperature, pressure, speed) and rationality checks of mold design. It is recommended to start with process parameter adjustment and gradually go deeper into the equipment and mold levels.