المشاكل والحلول

إجابات عملية على التحديات الشائعة في مواد البلاستيك

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Solvent residue in wet-process PI film

Solvent residue affects the electrical and thermal properties of PI films

Molding Process solvent residuechemical imidizationwashingsupercritical CO2

PI powder sintering insufficient density

Molding Process powder sinteringparticle sizedensitysintering temperature

PI imidization shrinkage too large

The chemical shrinkage of PI is a factor that must be considered in design and processing

Molding Process imidization shrinkagechemical shrinkagedimensional design

PI film uneven color

PI film color is very sensitive to heat treatment conditions

Molding Process PI filmcolor uniformityhot aircoating uniformity

Incomplete thermal imidization

The imidization degree (imidization rate) determines the final performance of PI

Molding Process imidization degree300°CIR spectroscopytreatment time

Product bubbles during imidization

Controlling water escape during imidization is the key to PI preparation

Molding Process imidizationwater vaporstep heatingbubblesPI film

PES product post-shrinkage

The dimensional stability of amorphous polymers requires sufficient post-processing

Molding Process post-shrinkagerelaxationannealingHDTdimensional stability

Product surface yellowing

The yellowing of PES is a direct manifestation of thermo-oxidation

Molding Process yellowingthermo-oxidationmelt temperatureantioxidantchromophores

PEI stress cracking after contacting organic solvents

Chemicals in the use environment need to be evaluated for compatibility with PEI

Molding Process solvent crackingsolvent resistanceannealingresidual stresschemical compatibility

PEEK product improper post-crystallization heat treatment

Molding Process post-crystallizationheat treatmentnitrogen protectionheating/cooling rateoxidative degradation

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