Residual stress in product

The product subsequently cracks or deforms. When this defect appears in products of Process No. 4, it is usually related to a specific process parameter range or equipment state. If it continues to appear, it will directly affect the product qualification rate and production rhythm, increasing material loss and rework costs. Timely diagnosis and elimination is a basic requirement for ensuring stable production.

1. Process parameter factors: uneven curing shrinkage, cooling rate too fast, transfer pressure too high, complex product structure with large wall thickness differences. 2. Runner and gate design factor: In transfer molding, the material needs to enter the cavity through runners and gates; the runner length, cross-sectional shape and gate size directly affect pressure loss, fiber breakage and filling balance, and unreasonable design is the root of many quality problems. 3. Feeding factor: The volume of the feeding chamber, the feeding amount and the preheating state of the material directly determine the transfer pressure and filling effect, and are key variables unique to transfer molding.

1. Process parameter optimization and adjustment: cure uniformly, cool slowly, appropriately lower the transfer pressure, optimize the product structure, anneal. 2. Systematic troubleshooting method: Troubleshooting of transfer molding problems follows the order of 'runner -> feeding -> parameters -> mold'. First check whether the runners and gates are blocked or worn, then verify the feeding amount and material preheating, then adjust the transfer pressure and speed, and finally check the mold venting and temperature uniformity. 3. Preventive management: Establish standardized process parameter cards and quality control limits for each set of mold/product, and regularly conduct process capability index (CPK) evaluations. For recurring problems, use fishbone diagrams or 5Why analysis to trace the root cause, and solidify the countermeasures as PFMEA control points.

This problem is a typical manifestation of residual stress in product in transfer molding; the core of the solution lies in the rational design of the runner and gate system, the effective transmission of transfer pressure, and the uniform control of mold temperature. It is recommended to start troubleshooting from the runner system and transfer parameters.