Thermal fatigue of mold materials for sintering high-temperature polymers (PEEK/PI)

Cracks appear on the mold surface under repeated thermal cycling. This problem is relatively common in sintering molding production and requires comprehensive analysis and solution from multiple aspects of material, process, and equipment.

(1) Mold aspect: The mold material (such as alloy steel) has a large thermal expansion coefficient, The mold structure or condition directly affects the flow and molding of the material in the cavity. (2) Equipment aspect: Frequent rapid cooling and heating leads to thermomechanical fatigue, Equipment precision and maintenance status affect the accurate execution of process parameters. (3) Material aspect: Fluctuations in raw material performance indicators or insufficient pretreatment affect molding quality. (4) Process aspect: Control deviation of key process parameters causes the '2079851475616104453 to deviate from optimal conditions. (5) Equipment aspect: Equipment precision and maintenance status affect the stable execution of process parameters.

(1) Material selection: Select low-expansion alloy or ceramic mold materials, Establish material selection evaluation criteria, and determine the optimal solution through comparative tests. (2) Material selection: Use a mold insertion/removal regime with transition temperature preheating, Establish material selection evaluation criteria, and determine the optimal solution through comparative tests. (3) Implementation measure: Subject the mold to aging treatment., Develop a specific operation plan based on actual production conditions, and verify the implementation effect. (4) Preventive measure: Establish sound process control standards and a quality inspection system, and regularly review process data for continuous optimization.

This problem requires comprehensive analysis from multiple dimensions of material, process, equipment, and operation, and should be solved by systematically optimizing process parameters and the quality control system.