Molding Process
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Dielectric Advantages and Molding Requirements of LCP in 5G High-Frequency Applications
Problembeschreibung
【Problem Phenomenon】When LCP is used for 5G antennas and high-frequency connectors, molding fluctuations cause dielectric consistency to fall below standard
Ursachenanalyse
LCP's dielectric loss is as low as about 0.002 and stable with frequency, making it an ideal material for 5G high frequency; but orientation differences cause dielectric anisotropy, and molding fluctuations affect batch consistency; Ringier literature records its dielectric characteristics and molding difficulties
Lösung
For high-frequency parts, solidify orientation-related process parameters: lock gate, injection speed and mold temperature; sample-inspect incoming dielectric batches; link key dimensions and dielectric performance in SPC; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Wichtigste Erkenntnis
LCP for 5G wins on dielectric; batch consistency relies on process locking and SPC; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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