Material Drying
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PA66 connector terminals
Problembeschreibung
Terminal retention force decreases after connector mating/unmating, and bubbling deformation occurs during reflow soldering
Ursachenanalyse
Connectors are thin-walled with multiple cavities, after PA66 absorbs moisture, water vaporizes and bubbles during reflow soldering; dry-state brittleness makes snap-fit retention force insufficient, and wear aggravates after repeated mating/unmating; during on-site troubleshooting, verify item by item according to this mechanism, avoiding blindly adjusting the machine based only on experience
Lösung
①For reflow soldering scenarios, strictly dry and select high-temperature resistant grades; ②Moisture conditioning after molding to restore snap-fit toughness; ③Terminal structure avoids sharp angle stress concentration; after adjustment, take continuous samples to verify the effect, confirm stability before resuming mass production
Wichtigste Erkenntnis
PA66 connectors must pass both reflow soldering and mating life; only three-line coordination of drying, moisture conditioning, and structural design can meet the standard; after confirming effectiveness, fix the parameters and practices into the work instructions to prevent recurrence
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