Molds & Tooling
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PARA Post-Crystallization Risk
Problembeschreibung
PARA low-temperature mold products crystallize in use, with dimensional change and performance fluctuation; DSC verification missing.
Ursachenanalyse
PARA mold temperature below 120°C causes insufficient crystallization; post-crystallization occurs when temperature rises in use; dimensional and performance changes; DSC analysis confirms the 80~120°C exothermic peak.
Lösung
①Mold temperature ≥120°C to ensure complete molding crystallization; ②DSC analysis to verify no post-crystallization peak; ③Heat treatment before high-temperature application; ④Dimensional stability verification.
Wichtigste Erkenntnis
PARA post-crystallization is a hidden risk of low-temperature molds; DSC is the confirmation means; prevention is better than after-the-fact treatment.; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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