Injection Molding
4 Aufrufe
DSTDP severe internal stress concentration
Problembeschreibung
DSTDP product internal stress >15MPa, causing cracking during storage
Ursachenanalyse
Injection speed too fast, orientation stress large; uneven cooling freezes thermal stress; improper gate position, flow orientation concentrated
Lösung
1) Reduce injection speed to reduce orientation; 2) uniform mold temperature to reduce thermal stress; 3) anneal 80°C/4h to release stress; 4) optimize gate position
Wichtigste Erkenntnis
Internal stress is caused by fast injection and uneven cooling; reducing speed, uniform cooling and annealing are key
War das hilfreich?
0 Personen fanden dies hilfreich
Vielen Dank für Ihr Feedback!