Injection Molding
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DSTDP severe internal stress concentration
Fenómeno del problema
DSTDP product internal stress >15MPa, causing cracking during storage
Análisis de la causa
Injection speed too fast, orientation stress large; uneven cooling freezes thermal stress; improper gate position, flow orientation concentrated
Solución
1) Reduce injection speed to reduce orientation; 2) uniform mold temperature to reduce thermal stress; 3) anneal 80°C/4h to release stress; 4) optimize gate position
Conclusión clave
Internal stress is caused by fast injection and uneven cooling; reducing speed, uniform cooling and annealing are key
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