Material Analysis
10 Aufrufe
Problem of poor matrix compatibility of high-temperature resistant masterbatch in PC applications
Problembeschreibung
High-temperature resistant masterbatch shows poor matrix compatibility during high-temperature processing of PC.
Ursachenanalyse
Improper temperature resistance grade of carrier resin.
Lösung
Solve by adjusting the masterbatch concentration.
Wichtigste Erkenntnis
The key of high-temperature resistant masterbatch lies in carrier resin matching.
War das hilfreich?
0 Personen fanden dies hilfreich
Vielen Dank für Ihr Feedback!