Material Analysis
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Problem of poor matrix compatibility of high-temperature resistant masterbatch in PC applications
Fenómeno do problema
High-temperature resistant masterbatch shows poor matrix compatibility during high-temperature processing of PC.
Análise das causas
Improper temperature resistance grade of carrier resin.
Solução
Solve by adjusting the masterbatch concentration.
Conclusão principal
The key of high-temperature resistant masterbatch lies in carrier resin matching.
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