Molding Process
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PC/ABS heat deflection temperature insufficient
Problembeschreibung
PC/ABS HDT does not meet heat resistance requirements (e.g., automotive interior 80-110°C).
Ursachenanalyse
PC/ABS HDT depends on PC content and processing conditions; HDT is about 100-120°C.
Lösung
Increase PC content; full annealing (80-100°C/2h) to increase HDT.
Wichtigste Erkenntnis
PC/ABS heat resistance can be improved through formulation and annealing.
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