Material Drying
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PA66 relay base
Fenómeno del problema
The relay base bubbles and deforms after wave soldering
Análisis de la causa
The instantaneous high temperature of wave soldering vaporizes the surface moisture of PA66 and causes bubbling, and thin-wall areas thermally deform; during on-site troubleshooting, verify item by item according to this mechanism, avoiding blindly adjusting the machine based only on experience
Solución
Fully dry and dehumidify before soldering; select high-temperature resistant grades; uniformize wall thickness in the pad area; after adjustment, take continuous samples to verify the effect, confirm stability before resuming mass production; change only one variable at a time and record parameter changes to facilitate locating effective measures
Conclusión clave
Soldered parts must be dried before soldering and temperature-resistant grades selected; after confirming effectiveness, fix the parameters and practices into the work instructions to prevent recurrence; include this case in the defect archive as a troubleshooting reference for subsequent similar problems
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