Processing Machinery
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PC Delayed Cracking
Fenómeno del problema
[Problem Phenomenon] PC passes inspection at the factory but cracks after a period of use
Análisis de la causa
Residual internal stress is released with delay under solvents, thermal cycling and loads; PC's stress relaxation characteristics; when troubleshooting on site, verify each item according to this mechanism one by one, and avoid blindly adjusting the machine based on experience alone
Solución
Anneal high-stress parts; environmental stress cracking evaluation; avoid stress concentration in assembly; after adjustment, take samples continuously to verify the effect, and resume mass production only after confirming stability; change only one variable at a time and record parameter changes, so as to locate effective measures
Conclusión clave
PC delayed cracking is a stress debt; annealing and evaluation for prevention; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
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