Processing Machinery
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PC Low-Temperature Embrittlement
Fenómeno del problema
[Problem Phenomenon] PC toughness decreases in low-temperature environments
Análisis de la causa
Although PC has good low-temperature toughness, it still decreases at extremely low temperatures; notches and stress concentration areas crack first; when troubleshooting on site, verify each item according to this mechanism one by one, and avoid blindly adjusting the machine based on experience alone; this mechanism has been repeatedly verified by industry data and should be confirmed first during troubleshooting
Solución
Impact verification for low-temperature parts; structural fillets; toughened grades; after adjustment, take samples continuously to verify the effect, and resume mass production only after confirming stability; change only one variable at a time and record parameter changes, so as to locate effective measures
Conclusión clave
PC has good low-temperature toughness but extremes still need verification; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
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