Injection Molding
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PLA '2079851475616104452 Brittle Cracking at Demolding
Fenómeno del problema
PLA products crack brittlely during demolding, shatter at the ejector pins, and the yield is low
Análisis de la causa
PLA's high brittleness makes it prone to cracking under demolding force; small ejector pin area concentrates stress; insufficient draft angle aggravates it; low mold temperature makes products more brittle; during on-site troubleshooting, verify item by item according to this mechanism, and avoid blindly adjusting the machine based solely on experience
Solución
①Large-area evenly distributed ejector pins; ②Increase the draft angle and polish; ③Appropriately increase the mold temperature to improve toughness; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Conclusión clave
PLA demolding must treat brittleness gently; large-area ejection plus sufficient draft angle is the basic configuration; after confirming effectiveness, fix the parameters and practices into the work instruction to prevent recurrence
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