Material Analysis
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Problem of bubble of high-temperature resistant masterbatch in ABS applications
Fenómeno del problema
High-temperature resistant masterbatch shows bubble during high-temperature processing of ABS.
Análisis de la causa
Improper temperature resistance grade of carrier resin.
Solución
Solve by selecting a high temperature resistant carrier resin.
Conclusión clave
The key of high-temperature resistant masterbatch lies in carrier resin matching.
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