Extrusion & Post
5 조회수
ASA double-layer structure interface peeling
문제 현상
After ASA is two-shot molded or overmolded with other materials, the interface peels, bond strength test fails, and delamination intensifies after thermal cycling.
원인 분석
The interface bonding of ASA with the substrate depends on material compatibility and temperature management; shrinkage difference between the two materials produces interface stress; surface contamination and insufficient temperature weaken molecular diffusion bonding.
해결 방법
①Verify compatibility and bond strength data of the two materials; ②substrate preheating and mold temperature optimize interface fusion; ③structural design mechanical interlock assistance; ④thermal cycling verifies interface reliability.
핵심 요약
The interface quality of ASA overmolding relies on dual guarantees of material matching and temperature; mechanical interlock is the reliability backstop; interface verification must include temperature cycling.; After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
이 정보가 도움이 되었나요?
0 명이 도움이 되었다고 합니다
의견 주셔서 감사합니다!