Extrusion & Post
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ASA double-layer structure interface peeling
Problembeschreibung
After ASA is two-shot molded or overmolded with other materials, the interface peels, bond strength test fails, and delamination intensifies after thermal cycling.
Ursachenanalyse
The interface bonding of ASA with the substrate depends on material compatibility and temperature management; shrinkage difference between the two materials produces interface stress; surface contamination and insufficient temperature weaken molecular diffusion bonding.
Lösung
①Verify compatibility and bond strength data of the two materials; ②substrate preheating and mold temperature optimize interface fusion; ③structural design mechanical interlock assistance; ④thermal cycling verifies interface reliability.
Wichtigste Erkenntnis
The interface quality of ASA overmolding relies on dual guarantees of material matching and temperature; mechanical interlock is the reliability backstop; interface verification must include temperature cycling.; After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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