Molds & Tooling
3 조회수
PC Warpage Deformation
문제 현상
PC products deform after demolding, assembly part gaps are uneven, obvious on flat and frame parts.
원인 분석
PC is an amorphous material with lower warpage tendency than crystalline materials, but uneven cooling, frozen stress from excessive holding pressure, large wall thickness differences, and ejection force can still cause warpage; the main cause of PC warpage is stress rather than crystallization shrinkage.
해결 방법
①Control core and cavity temperature in separate circuits with temperature difference <5°C; ②Reduce holding pressure and extend cooling; ③Make wall thickness uniform; ④Balance ejection; ⑤Use a shaping fixture to constrain cooling for deformed parts.
핵심 요약
For PC warpage, mainly check 'holding pressure and uneven cooling' rather than crystallization: as an amorphous material, PC's warpage is more of a stress problem; restraining the holding pressure and making the temperature field uniform, warpage is mostly controllable.
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