Molds & Tooling
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PC Warpage Deformation
Fenómeno del problema
PC products deform after demolding, assembly part gaps are uneven, obvious on flat and frame parts.
Análisis de la causa
PC is an amorphous material with lower warpage tendency than crystalline materials, but uneven cooling, frozen stress from excessive holding pressure, large wall thickness differences, and ejection force can still cause warpage; the main cause of PC warpage is stress rather than crystallization shrinkage.
Solución
①Control core and cavity temperature in separate circuits with temperature difference <5°C; ②Reduce holding pressure and extend cooling; ③Make wall thickness uniform; ④Balance ejection; ⑤Use a shaping fixture to constrain cooling for deformed parts.
Conclusión clave
For PC warpage, mainly check 'holding pressure and uneven cooling' rather than crystallization: as an amorphous material, PC's warpage is more of a stress problem; restraining the holding pressure and making the temperature field uniform, warpage is mostly controllable.
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