Molds & Tooling
3 조회수
PC mold temperature 80-120℃
문제 현상
Products have large internal stress, transparent parts become hazy, stress cracking after storage, or poor surface replication
원인 분석
When mold temperature is below 80℃, the melt surface layer is rapidly cooled, molecular chains are frozen before they can relax, residual stress is high, and transparent parts are prone to haze; appropriately increasing mold temperature can promote de-orientation and reduce stress
해결 방법
①Mold temperature set at 80-120℃, complex-structure and transparent parts take 100-120℃; ②Use a mold temperature controller to control the temperature difference to less than 5℃; ③Do not excessively lower mold temperature on the grounds of shortening the cycle
핵심 요약
Mold temperature is the first variable of PC stress control; orthogonal tests confirm that mold temperature has the greatest influence on stress cracking, and 100-120℃ is the recommended range；After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
이 정보가 도움이 되었나요?
0 명이 도움이 되었다고 합니다
의견 주셔서 감사합니다!