Molds & Tooling
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PC mold temperature 80-120℃
Problem Phenomenon
Products have large internal stress, transparent parts become hazy, stress cracking after storage, or poor surface replication
Cause Analysis
When mold temperature is below 80℃, the melt surface layer is rapidly cooled, molecular chains are frozen before they can relax, residual stress is high, and transparent parts are prone to haze; appropriately increasing mold temperature can promote de-orientation and reduce stress
Solution
①Mold temperature set at 80-120℃, complex-structure and transparent parts take 100-120℃; ②Use a mold temperature controller to control the temperature difference to less than 5℃; ③Do not excessively lower mold temperature on the grounds of shortening the cycle
Key Takeaway
Mold temperature is the first variable of PC stress control; orthogonal tests confirm that mold temperature has the greatest influence on stress cracking, and 100-120℃ is the recommended range；After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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