Laminate "drilling-out/punching delamination"

Delamination occurs during mechanical processing (drilling/punching). The interlayer separation phenomenon gradually expands after the product is stressed or subjected to environmental action, seriously affecting structural integrity.

(1) Process factor: insufficient interlayer bonding strength; this factor affects the '2079851475616104453 and final quality of the product. (2) Process factor: improper processing parameters (feed too large; this factor affects the '2079851475616104453 and final quality of the product. (3) Process factor: drill bit dulling); this factor affects the '2079851475616104453 and final quality of the product. (4) Process factor: board brittleness high; this factor affects the '2079851475616104453 and final quality of the product.

(1) Material selection: use new drill bits and appropriate rotation speed and feed parameters; establish material selection evaluation standards and determine the optimal solution through comparative tests. (2) Implementation measures: improve interlayer bonding strength; formulate specific operation plans based on actual production conditions and verify implementation effects. (3) Preparatory work: preheat the board before processing to improve toughness., use a thermometer to confirm that the temperature of all parts of the mold is uniform and up to standard before starting production. (4) Preventive measures: establish interlayer bonding strength testing standards, regularly sample interlayer shear strength, and monitor process parameter stability.

The essence of interlayer separation problems is insufficient interface bonding force, requiring systematic improvement from three aspects: impregnation quality, interlayer cleanliness, and process parameters.