Molds & Tooling
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PARA Creep Tendency
Problem Phenomenon
PARA products creep and deform under long-term load, aggravated by low-temperature mold molding, with structural failure.
Cause Analysis
When PARA mold temperature is below 120°C, creep tendency is higher; insufficient crystallinity reduces creep resistance; long-term load accumulation; high-temperature environment accelerates.; during on-site troubleshooting, verify item by item according to this mechanism, avoiding blind machine adjustment based only on experience
Solution
①Mold temperature ≥120°C to ensure crystallinity; ②Design stress according to creep data; ③High-temperature application verification; ④Long-term deformation tracking.; after adjustment, continuously sample to verify the effect, and resume mass production only after confirming stability
Key Takeaway
PARA creep management starts with mold temperature crystallization; design stress limits must be observed; long-term data supports application.; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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