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Material Analysis 2 views

PBT Thin-Wall High-Flow Demand

Problem Phenomenon
Thin-walled electronic components cannot be filled completely, raising pressure causes flash, and flow modification raises concerns about performance
Cause Analysis
The thinning of electronic and electrical components requires materials with higher fluidity; low-molecular-weight PBT flows well but its mechanical properties decline; CBT cyclic oligoester can greatly improve flow with a very small addition amount and hardly affects mechanical properties
Solution
①For high-flow requirements select CBT-modified grades; ②Avoid simply reducing molecular weight at the expense of performance; ③For highly filled grades select dedicated high-flow series; after adjustment, take samples continuously to verify the effect, and resume mass production only after confirming stability
Key Takeaway
The preferred flow solution for PBT thin-walling is CBT-type modification; reducing molecular weight is the worst option, functional additives are the best option; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
PBT; thin wall; high flow; CBT; low molecular weight

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