Processing Machinery
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Particle Contamination of PEEK Semiconductor Parts
Problem Phenomenon
PEEK semiconductor equipment parts release particles during use, contaminating the wafer environment; the customer's cleanliness test fails, and tracing finds it was introduced in the processing stage.
Cause Analysis
During processing, degraded carbides, glass fiber debris, and equipment wear particles are mixed into the products; post-machining cutting debris is not thoroughly cleaned; packaging and handling stages secondarily contaminate cleanliness-sensitive parts.
Solution
①Control degradation and contamination sources throughout the process; ②Ultrasonically clean products to remove attached particles; ③Package and transfer in a clean environment; ④Establish a factory standard for particle count testing.
Key Takeaway
The competitive dimension of semiconductor PEEK parts is cleanliness control; tracing particle contamination must cover the entire chain from processing to packaging; ultrasonic cleaning is the standard post-treatment process.
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