Processing Machinery
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POM Internal Stress
Problem Phenomenon
Cracks appear after POM parts are wiped with solvent
Cause Analysis
Residual stress releases and cracks under solvent action (stress cracking); during on-site troubleshooting, verify item by item according to this mechanism, and avoid blindly adjusting the machine based only on experience; this mechanism has been repeatedly verified by industry literature and should be confirmed first during troubleshooting
Solution
Raise mold temperature to reduce stress; annealing treatment; avoid contact with strong solvents; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability; change only one variable at a time and record parameter changes to facilitate locating effective measures
Key Takeaway
POM stress cracking is addressed by process stress reduction and solvent avoidance; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a troubleshooting reference for subsequent similar problems
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