Material Analysis
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Problem of carrier degradation of high-temperature resistant masterbatch in PC applications
Problem Phenomenon
High-temperature resistant masterbatch shows carrier degradation during high-temperature processing of PC.
Cause Analysis
Improper pigment temperature resistance of carrier resin.
Solution
Solve by optimizing pigment/additive temperature resistance.
Key Takeaway
The key of high-temperature resistant masterbatch lies in carrier resin matching.
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