Material Analysis
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Problem of masterbatch agglomeration of high-temperature resistant masterbatch in PBT applications
Problem Phenomenon
High-temperature resistant masterbatch shows masterbatch agglomeration during high-temperature processing of PBT.
Cause Analysis
Improper matching between carrier resin and matrix.
Solution
Solve by adjusting the masterbatch concentration.
Key Takeaway
The key of high-temperature resistant masterbatch lies in carrier resin matching.
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