Insufficient transfer pressure

The material cannot fill the cavity or the compactness is low. When this defect appears in products of Process No. 4, it is usually related to a specific process parameter range or equipment state. If it continues to appear, it will directly affect the product qualification rate and production rhythm, increasing material loss and rework costs. Timely diagnosis and elimination is a basic requirement for ensuring stable production.

1. Process parameter factors: insufficient hydraulic system pressure, plunger cross-sectional area not matching the barrel, material viscosity too high, runner resistance too large. 2. Feeding factor: The volume of the feeding chamber, the feeding amount and the preheating state of the material directly determine the transfer pressure and filling effect, and are key variables unique to transfer molding.

1. Process parameter optimization and adjustment: increase the hydraulic system pressure, match the plunger and barrel sizes, preheat the material to reduce viscosity, optimize the runner to reduce resistance. 2. Systematic troubleshooting method: Troubleshooting of transfer molding problems follows the order of 'runner -> feeding -> parameters -> mold'. First check whether the runners and gates are blocked or worn, then verify the feeding amount and material preheating, then adjust the transfer pressure and speed, and finally check the mold venting and temperature uniformity. 3. Preventive management: Establish standardized process parameter cards and quality control limits for each set of mold/product, and regularly conduct process capability index (CPK) evaluations. For recurring problems, use fishbone diagrams or 5Why analysis to trace the root cause, and solidify the countermeasures as PFMEA control points.

This problem is a typical manifestation of insufficient transfer pressure in transfer molding; the core of the solution lies in the rational design of the runner and gate system, the effective transmission of transfer pressure, and the uniform control of mold temperature. It is recommended to start troubleshooting from the runner system and transfer parameters.