Extrusion & Post
8 visualizações
Low peel strength between copper foil and substrate
Fenómeno do problema
Insufficient peel strength at the interface between copper foil and substrate of copper-clad laminates (CCL).
The decline in mechanical properties is usually only discovered during product service or testing stages, and is concealed.
This defect significantly reduces the mechanical properties and service life of the product and may cause early failure of the product during service.
Análise das causas
(1) Process factor: oxidation or contamination of the roughened surface of copper foil; this factor affects the '2079851475616104453 and final quality of the product.
(2) Process factor: insufficient chemical bonding between copper foil and resin; this factor affects the '2079851475616104453 and final quality of the product.
(3) Process factor: insufficient curing degree, interface not fully bonded; this factor affects the '2079851475616104453 and final quality of the product.
Solução
(1) Material selection: use freshly roughened copper foil promptly; establish material selection evaluation standards and determine the optimal solution through comparative tests.
(2) Material selection: choose resin systems with good bonding to copper foil; establish material selection evaluation standards and determine the optimal solution through comparative tests.
(3) Implementation measures: fully cure., formulate specific operation plans based on actual production conditions and verify implementation effects.
(4) Preventive measures: establish a raw material batch inspection system, regularly sample product density and mechanical properties, and establish quality trend analysis.
Conclusão principal
The core cause of insufficient mechanical properties is inadequate material bonding or degradation; the sintering/curing process needs to be optimized and raw material quality controlled.
Isto foi útil?
0 pessoas acharam isto útil
Obrigado pelo seu comentário!