Molds & Tooling
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LCP Lead-free Reflow Soldering Warpage
Fenómeno do problema
Electronic connectors warp and deform after lead-free reflow soldering (245~260℃).
Análise das causas
Uneven wall thickness or improper gate position unbalances internal orientation stress in the product; even if the grade temperature resistance is qualified, stress release at reflow soldering high temperature still causes warpage.; during on-site troubleshooting, verify item by item according to this mechanism to avoid blindly adjusting the machine based solely on experience
Solução
①Uniform wall thickness design; ②optimize gate position to control orientation; ③select reflow-soldering-resistant grades; ④perform thermal simulation verification before reflow soldering.; after adjustment, continuously sample to verify the effect, and resume mass production only after confirming stability
Conclusão principal
LCP reflow soldering warpage is a design and orientation problem rather than a material temperature resistance problem; uniform wall thickness plus reasonable gate is the fundamental prevention.; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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