Processing Machinery
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Poor Coplanarity of LCP Thin-Wall Connectors
Fenómeno do problema
【Problem Phenomenon】Coplanarity of the terminal area of multi-pin thin-wall connectors is out of tolerance, causing SMT mounting cold solder joints
Análise das causas
Orientation shrinkage differences of the thin-wall multi-rib structure superimposed with ejection stress cause the product to warp after cooling, resulting in poor coplanarity; a common quality topic in LCP connector mass production; during on-site troubleshooting, verify item by item according to this mechanism to avoid blindly adjusting the machine based solely on experience
Solução
Uniform mold temperature and symmetric holding design reduce internal stress; balanced ejection layout prevents ejection deformation; if necessary, use a reshaping fixture for sizing and verify coplanarity after reflow soldering; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Conclusão principal
Connector coplanarity is guaranteed by symmetric process and balanced ejection, with reshaping as the last resort; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a troubleshooting reference for subsequent similar problems
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