Material Drying
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PA6 Electronic Connector
Fenómeno do problema
Connector terminal retention force is insufficient, blistering and deformation occur after reflow soldering, and mating life does not meet the standard
Análise das causas
The thin walls and multiple cavities of connectors demand high flowability, but after moisture absorption, the moisture vaporizes and blisters during reflow soldering; dry-state brittleness reduces the terminal latch retention force and mating durability
Solução
①For reflow soldering scenarios, select hydrolysis-resistant high-temperature grades and dry strictly; ②condition after molding to improve latch toughness; ③thin-wall design combined with high-speed filling process; after adjustment, continuously sample to verify the effect, and resume mass production after confirming stability
Conclusão principal
Electronic connectors test PA6's dual resistance to humidity and heat; only with the three links of grade, drying, and conditioning tightly connected can it pass both reflow soldering and mating life; after confirming effectiveness, fix the parameters and practices into the work instructions to prevent recurrence
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