Material Analysis
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Problem of masterbatch agglomeration of high-temperature resistant masterbatch in PC applications
Fenómeno do problema
High-temperature resistant masterbatch shows masterbatch agglomeration during high-temperature processing of PC.
Análise das causas
Improper matching between carrier resin and matrix.
Solução
Solve by adjusting the masterbatch concentration.
Conclusão principal
The key of high-temperature resistant masterbatch lies in carrier resin matching.
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